The Influence of Resilience on Social Creativity: Chain Mediation Effects of Sense of Humor and Positive Mood

Autor/inn/en	Li, Yadan; Liu, Chunyu; Yang, Yilong; Du, Ying; Xie, Cong; Xiang, Shuoqi; Duan, Haijun; Hu, Weiping
Titel	The Influence of Resilience on Social Creativity: Chain Mediation Effects of Sense of Humor and Positive Mood
Quelle	In: Psychology in the Schools, 59 (2022) 8, S.1609-1622 (14 Seiten)Infoseite zur Zeitschrift PDF als Volltext Verfügbarkeit
Sprache	englisch
Dokumenttyp	gedruckt; online; Zeitschriftenaufsatz
ISSN	0033-3085
DOI	10.1002/pits.22718
Schlagwörter	Resilience (Psychology); Humor; Creativity; Correlation; Psychological Patterns; Models; Student Attitudes; Undergraduate Students; Academic Achievement; Foreign Countries; China + Suchen Sie Ihr Suchwort? Humoristische Darstellung; Kreativität; Korrelation; Analogiemodell; Schülerverhalten; Schulleistung; Ausland
Abstract	Though previous research has established a strong link between resilience and cognitive creativity, few studies have extended this association to social creativity. The underlying mechanisms of the influence of resilience on social creativity remain unknown. Therefore, the current study introduced sense of humor and positive mood to explore the influence of resilience on social creativity. We established a chain mediation model with data from 186 Chinese college students. The results showed that resilience was associated with social creativity. The sense of humor and positive mood were serial mediators in this relationship. The results have demonstrated that student participants with higher levels of resilience are more likely to use humor in their study, which may help them get a more positive mood than their counterparts with lower levels of resilience. Then, positive mood is conducive to students' performance of social creativity. (As Provided).
Anmerkungen	Wiley. Available from: John Wiley & Sons, Inc. 111 River Street, Hoboken, NJ 07030. Tel: 800-835-6770; e-mail: cs-journals@wiley.com; Web site: https://www.wiley.com/en-us
Erfasst von	ERIC (Education Resources Information Center), Washington, DC
Update	2024/1/01