Literaturnachweis - Detailanzeige
Autor/inn/en | Japutra, Arnold; Wang, Shasha; Li, Ting |
---|---|
Titel | The Influence of Self-Congruence and Relationship Quality on Student Educational Involvement |
Quelle | In: Journal of Marketing for Higher Education, 33 (2023) 1, S.40-57 (18 Seiten)Infoseite zur Zeitschrift
PDF als Volltext |
Zusatzinformation | ORCID (Japutra, Arnold) ORCID (Wang, Shasha) |
Sprache | englisch |
Dokumenttyp | gedruckt; online; Zeitschriftenaufsatz |
ISSN | 0884-1241 |
DOI | 10.1080/08841241.2021.1884928 |
Schlagwörter | Higher Education; Marketing; Congruence (Psychology); College Students; Student Participation; Student Satisfaction; Trust (Psychology); Student Motivation; Consumer Economics; Educational Benefits |
Abstract | While student class involvement (i.e. engagement in classes) has been studied thoroughly, student educational involvement (i.e. willingness to take education) is rarely studied. Such research is essential due to decreased student enrolment in education. A survey of 425 participants was conducted to explore the influence of self-congruence and relationship quality on student educational involvement. The findings indicate that both actual and ideal self-congruence is positively related to relationship quality (i.e. satisfaction, trust, commitment and social benefits). Interestingly, while ideal self-congruence influences educational involvement positively, actual self-congruence does not have an influence. The majority of relationship quality items, including satisfaction, trust and commitment are positively linked to educational involvement. Academic and managerial implications are discussed. Particularly, the results suggested marketing remedies to enhance student educational involvement in further education. (As Provided). |
Anmerkungen | Routledge. Available from: Taylor & Francis, Ltd. 530 Walnut Street Suite 850, Philadelphia, PA 19106. Tel: 800-354-1420; Tel: 215-625-8900; Fax: 215-207-0050; Web site: http://www.tandf.co.uk/journals |
Erfasst von | ERIC (Education Resources Information Center), Washington, DC |
Update | 2024/1/01 |