Literaturnachweis - Detailanzeige
Autor/inn/en | Guu, Y. H.; Lin, Kuen-Yi; Lee, Lung-Sheng |
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Titel | Identifying Professional Competencies of the Flip-Chip Packaging Engineer in Taiwan |
Quelle | In: Turkish Online Journal of Educational Technology - TOJET, 13 (2014) 4, S.61-70 (10 Seiten)
PDF als Volltext |
Sprache | englisch |
Dokumenttyp | gedruckt; online; Zeitschriftenaufsatz |
ISSN | 1303-6521 |
Schlagwörter | Foreign Countries; Engineering; Technical Occupations; Competence; Delphi Technique; Interviews; Questionnaires; Electronic Equipment; Measures (Individuals); Reliability; Taiwan |
Abstract | This study employed a literature review, expert interviews, and a questionnaire survey to construct a set of two-tier competencies for a flip-chip packaging engineer. The fuzzy Delphi questionnaire was sent to 12 flip-chip engineering experts to identify professional competencies that a flip-chip packaging engineer must have. Four competencies, including flip-chip technology, bumping process, stress analysis, and reliability testing, and their subordinate 15 competency indicators were developed. The results serve as a reference for designing or assessing curricula or programs for preparing a quality flip-chip packaging engineer and to be used as a guideline to recruit and select a flip-chip packaging engineer. (As Provided). |
Anmerkungen | Sakarya University. Esentepe Campus, Adapazari 54000, Turkey. Tel: +90-505-2431868; Fax: +90-264-6141034; e-mail: tojet@sakarya.edu.tr; Web site: http://www.tojet.net |
Erfasst von | ERIC (Education Resources Information Center), Washington, DC |
Update | 2017/4/10 |